NVIDIA’s Jensen Huang: Huawei’s “Tao’s Law” a breakthrough for Huawei (华为), but not a threat to TSMC (台积电)

Key takeaway

It has been reported that NVIDIA CEO Jensen Huang (黄仁勋), speaking after a “万亿美元晚宴” event in Taipei, called Huawei’s (华为) newly unveiled “Tao’s Law” and LogicFolding approach a technological breakthrough for Huawei but said it does not threaten TSMC (台积电). The remarks were made during a May 28 interview in Taiwan and reported by regional media. Short version: stacking and 3D packaging help, but they don’t instantly replace decades of foundry leadership.

What Huang said and why it matters

Huang reportedly noted that TSMC has employed chip stacking and 3D packaging for nearly a decade and has very mature tooling and know‑how. He described Huawei’s approach as “a very good technique” that can double or even triple die counts without pushing process nodes smaller, but stressed that such techniques build on capabilities TSMC already possesses. Does that blunt Huawei’s advance? Not immediately, according to Huang: packaging is complementary, not a full substitute for leading‑edge lithography and volume foundry scale.

The broader context

It has been reported that Huawei’s board member He Tingbo (何庭波) introduced “Tao’s Law” at the 2026 International Circuits and Systems symposium, outlining a multi‑level co‑optimization from device to system and claiming that by 2031 transistor density could reach the equivalent of a 1.4 nm process. Those projections remain claims for now. Geopolitics matters: U.S. export controls and restrictions on advanced equipment have pushed Chinese firms to pursue alternative paths like chiplet integration and 3D stacking. Still, the global foundry landscape—scale, yield, IP and supply relationships—gives incumbents like TSMC significant staying power.

In short: Huawei’s research may reshape parts of the roadmap and raise the stakes in design and packaging innovation. But for the foreseeable future, Huang’s view suggests, it’s an evolution that complements rather than displaces the extremely hard‑won advantages of leading foundries.