Huawei (华为)'s He Tingbo: The performance of our new chip can fully and consistently match the alternative path

Bold claim and a new law

Huawei (华为) executive Ms. He Tingbo (何庭波) used a keynote at the 2026 International Circuit and Systems Symposium to unveil what she called the "韬（τ）定律" — a new guiding principle for semiconductor development. It has been reported that Huawei framed the law as a long-term industry roadmap running from 2026 to 2035, during which transistor density and operating frequencies will steadily rise as exploratory technologies move into products. Short version: Huawei says its approach is viable and durable.

What she announced

He said, “我们的解决方案走得通，走得远。我们新芯片的性能完全可以持续对标另外一条路径。” — our solution can go the distance; our new chips' performance can fully and consistently match the alternative path. She laid out expectations that Huawei will continue to ship high-performance mobile chips as transistor scaling and frequency improvements proceed. It has been reported that the company presented this as China’s first industry-level proposal of a new semiconductor development principle.

Geopolitics and the technology challenge

Why does this matter to Western readers? Huawei’s push comes amid years of U.S. export controls and other trade-policy measures that have constrained Chinese firms’ access to cutting-edge foundry tools and advanced packaging equipment. Those restrictions have driven Chinese vendors to pursue “alternative paths” — from architecture and system co-design to more reliance on domestic suppliers and innovative packaging — rather than simply chasing the most advanced nodes. Can engineering and systems innovation fully substitute for missing toolchains and fab access? He is betting yes.

About the speaker

He Tingbo, born in 1969, graduated from Beijing University of Posts and Telecommunications with dual bachelor’s and master’s degrees in semiconductor physics and communications engineering. She joined Huawei in 1996 and has held roles across chip development, research, architecture and supply chain; past titles include head of HiSilicon and president of the 2012 Lab. She is currently chair of Huawei’s Scientific Committee and president of its semiconductor division, responsible for executing the roadmap she outlined. It has been reported by IT之家 that the speech crystallized Huawei’s public strategy for the coming decade.