Xiaomi insider Hu Xinxin "internally reveals" REDMI K90 Max: industry-rare metal bearings and metal cooling fins — new phone to debut this month

Leak from a product manager focuses on an unusual cooling system

It has been reported that Redmi (REDMI/红米) product manager Hu Xinxin (胡馨心) posted a short video today that “internally reveals” parts of the forthcoming Redmi K90 Max. The clip did not show the phone’s final exterior design, but it did display internal components and several claims about an active wind‑cooling system Xiaomi (小米) is preparing to ship. According to the video, the fan-assisted cooling can drop device temperature by 10°C within 100 seconds, with a measured noise level of about 32 dB under the company’s test conditions — a claim Hu framed against rival measurement practices.

Metal bearings, metal fins and a sealed structure

The standout detail is hardware: Redmi’s new wind‑cooling module reportedly uses metal bearings and metal cooling fins — components that Xiaomi says are rare in the smartphone industry — plus a “suspended sealed” frame. Xiaomi claims this architecture both improves thermal transfer and reduces the risk of liquid ingress to the motherboard, while preserving battery life and allowing the phone to maintain IP66/68/69 water‑resistance ratings. It has been reported that the fan’s additional power draw is largely offset by lower sustained power consumption once temperatures fall.

Specs, launch timing and market positioning

It has been reported that the K90 Max has already opened reservations and will debut this month. Xiaomi is billing the phone as its first device with an active wind‑cooling solution, paired with a “next‑gen dual‑core” performance platform and a 165 Hz gaming display — a spec sheet aimed at the competitive mid‑to‑high‑end gaming market in China and abroad. Will consumers tolerate a moving part in a pocketed smartphone for better sustained performance? Xiaomi is clearly betting they will.

Why this matters beyond specs

For Western readers unfamiliar with the fast‑moving Chinese handset market: Chinese brands routinely push hardware innovation and aggressive pricing to win market share at home and overseas. The move toward fan‑assisted cooling underscores how firms like Xiaomi are differentiating on thermals and sustained benchmark performance as raw silicon gains slow. It has been reported that details above come from an internal‑facing video rather than independent teardown tests, so independent reviews will be needed to confirm real‑world noise, durability and waterproofing claims — and to see how this approach fares amid broader geopolitical pressures on supply chains and component sourcing.