Geely launches Xingyue L (星越 L) Changfeng Edition with limited-time price from ¥124,700

Launch and pricing

Geely (吉利汽车) has added a new member to its compact SUV line-up, launching the Xingyue L Changfeng Edition (星越 L 长风版) with a limited-time entry price of 124,700 yuan. The model is offered in two trims with an official guide price of 139,700–147,700 yuan and a promotional price band of 124,700–132,700 yuan. Buyers are also being offered a package of incentives including seven years of ultra‑low‑interest financing and a suite of branded purchase benefits — described by Geely as 星喜红包礼, 星喜焕新礼, 星喜金融礼, 星喜质享礼, 星喜保养礼 and 星喜流量礼.

Design, cabin and connectivity

The Changfeng Edition continues the Xingyue L series’ “space‑time symphony” design language, featuring a recessed waterfall grille with blacked‑out sport trim and a full‑width “aurora dot‑matrix” LED tail lamp. Need passenger space? The car measures 4,770 mm long, 1,895 mm wide and 1,689 mm tall with a 2,845 mm wheelbase. Inside, Geely equips the cabin with a three‑screen smart cockpit — a 12.3‑inch instrument cluster plus dual 14.6‑inch central and passenger displays — driven by Qualcomm’s Snapdragon 8155 chip and running Flyme Auto. The system reportedly integrates Deepseek large‑model technology and supports HUAWEI HiCar (华为 HiCar) and Carlink smartphone mirroring. Higher trims add HUD, heated/ventilated/massage front seats, rear seat recline and an L2‑level driver assistance package.

Powertrain and geopolitical context

Under the bonnet the Changfeng Edition uses a 2.0‑litre “low‑power” turbocharged engine paired with a seven‑speed wet dual‑clutch transmission, producing 218 hp (160 kW) and 325 N·m of torque. The package is aimed at buyers wanting near‑premium tech and comfort in a compact SUV footprint. In the broader context of U.S.‑China technology tensions and export controls on advanced semiconductors, the continued use of Qualcomm chips underscores how Chinese automakers still rely on global suppliers for high‑performance in‑vehicle computing — even as domestic firms push to localize more of the software and AI stack.